Introduction

Candela 8420 uses classic Candela technology of multichannel and rule-based binning to detect and classify multiple yield-impacting defects on wafer surface. Standard Candela technology combines reflectometry, optical profilometry, scatterometry and phase shift to measure topographic variations and detect a wide variety of surface defects. The inspection method achieves fullsurface coverage in minutes to produce high-resolution imaging, wafer maps and automated defect classification.